| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c8401bd1a86a10d5508942a53475fc38 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-244
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C2-16 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-24 |
| filingDate |
2002-09-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cb5e9e9d42dc899756c0691bedaaa41c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a16be379b1faae6a428c719c3e74f471 |
| publicationDate |
2005-03-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20050029220-A |
| titleOfInvention |
Immersion plating of silver |
| abstract |
The problem with forming a solderable and bondable layer on a printed circuit board is that its surface is corroded after storage of the substrate prior to further processing (mounting of electrical components), thus affecting solderability and bondability. To overcome this problem, the first step deposits the first metal, which is more precious than copper, on the printed circuit board, and the second step is at about half the rate of plating silver in the second step when the first metal is silver. It is proposed to plate the silver under the conditions under which the first metal is deposited. |
| priorityDate |
2002-07-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |