http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20050012758-A
Outgoing Links
Predicate | Object |
---|---|
classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K59-173 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0048 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0233 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-037 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K50-844 |
classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-32 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-037 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-023 |
filingDate | 2003-05-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate | 2005-02-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | KR-20050012758-A |
titleOfInvention | Photosensitive Resin Composition and Method for Preparing Heat-Resistant Resin Film |
abstract | This invention contains (a) resin which has a specific structure, (b) photosensitive agent, (c) organic solvent whose boiling point under atmospheric pressure is 100 degreeC or more and 140 degrees C or less, and content of (c) component is 50 weight with respect to organic solvent whole quantity. It relates to the photosensitive resin composition which is% or more and 100 weight% or less, and the manufacturing method of the heat resistant resin film using the same. The photosensitive resin composition which does not produce defects, such as a trace of a transcription | transfer and line drawing, is provided by this invention. |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101227280-B1 |
priorityDate | 2002-05-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 510.