| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29K2063-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29B9-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29B9-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29B9-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29B9-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C45-462
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-56 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29B9-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29B9-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29B9-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29B9-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C45-46 |
| filingDate |
2004-07-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_694493041fdd298d0eda72b0da92614b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_04a188d89567c75339ace65a10f3f604
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6ad1ee30387a3f31623636978ef472b0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cc7c5c77612fe33941297b2cec9a023a |
| publicationDate |
2005-01-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20050009234-A |
| titleOfInvention |
Method for producing a semiconductor-molding tablet, a semiconductor-molding tablet obtained thereby and a semiconductor device using the same |
| abstract |
The present invention provides a method of manufacturing a tablet for semiconductor encapsulation that can reduce the generation of voids in a package by densification of a tablet.n n n After preparing a kneaded product of the epoxy resin composition containing the following components (A) to (C) as essential components, the kneaded material was molded into a sheet shape with a sheet density ratio of 98% or more, and the sheet-shaped molded product was pulverized. It is a manufacturing method of the tablet for semiconductor sealing formed by tablet-molding the grind | pulverized material into the tablet form of tablet density ratio 94% or more and less than 98%:n n n (A) an epoxy resin;n n n (B) phenol resins; Andn n n (C) inorganic fillers. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2018236052-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11702537-B2 |
| priorityDate |
2003-07-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |