| abstract |
Provided are a semiconductor device manufacturing method capable of efficiently manufacturing a flip chip type semiconductor device having excellent heat and moisture resistance and high reliability, and a semiconductor device manufactured by the above method. In the method of manufacturing a semiconductor device mounted by a flip chip method, after bonding a semiconductor device to a circuit board using a thermosetting resin, applying a photocurable resin to the periphery of the semiconductor element and photocuring to form a fillet. A method of manufacturing a semiconductor device, and a semiconductor device in which a semiconductor device is mounted on a circuit board by a flip chip method, wherein the semiconductor device is joined to the circuit board by a thermosetting resin in a lower portion thereof, and the peripheral portion thereof. Semiconductor field, characterized in that the fillet is formed by a photocurable resin . |