| abstract |
The present invention provides (A) abrasive particles, (B) 2-bromo-2-nitro-1,3-propanediol, 2-bromo-2-nitro-1,3-butanediol, 2,2-dibromo Chemistry containing at least one compound selected from the group consisting of 2-nitroethanol and 2,2-dibromo-3-nitrilopropionamide, and (C) an organic component other than the compound of component (B) / Aqueous dispersion for mechanical polishing. Even if the aqueous dispersion is stored or used in a neutral pH range, there is no problem of decay, and especially when used in the STI process in the manufacture of semiconductor devices, an excellent polished surface with less occurrence of dishing or scratching can be obtained. . |