http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20050003282-A

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b1007735376d07808ebe297f823b2829
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02F1-13452
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G02F1-1345
filingDate 2003-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_085575bec2aaeb285e62957cd7104196
publicationDate 2005-01-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20050003282-A
titleOfInvention Pad structure of chip on glass package liquid crystal display device
abstract BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the formation of an auto probe inspection pattern on a pad in a liquid crystal display device having a COG structure in which a driving IC is directly mounted on a substrate.n n n Before attaching the driving IC, the liquid crystal panel is inspected for defects. At this time, the liquid crystal panel needs to input an image signal to the gate wiring and the data wiring, and the auto probe has a needle that can input a signal by contacting each wiring. And the needle is brought into contact with the gate face of the liquid crystal panel and a part of the data pad to input an image signal for defect inspection. At this time, since the pad portion in contact with the needle of the autobub portion should be conductive, the protective layer formed on the pad is removed.n n n However, as described above, the pad portion, in which the protective layer is removed and opened, causes a problem such as a short by foreign matter and a short during bonding of the driving IC due to the expansion of the conductive region.n n n In the present invention, by providing a COG mounting structure liquid crystal display device having a pad structure that opens only the contact portion of the autobrobe needle for defect inspection, it is possible to prevent the short and the like when bonding the driving IC.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10043478-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9070594-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7923728-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2007049895-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20110039124-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20160074801-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-107919067-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101427135-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8865533-B2
priorityDate 2003-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419576644
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID2201

Total number of triples: 22.