| abstract |
The present invention provides a positive photosensitive resin composition comprising (A) an alkali-soluble resin, (B) a diazoquinone compound and a compound containing a -CH 2 OH group without including (C) a phenolic hydroxyl group, a pattern using the composition Provided are a method for producing a mold resin film, a semiconductor device using the composition, and a method for producing the semiconductor device. Moreover, this invention is a positive photosensitive composition containing (A) alkali-soluble resin, (B) diazoquinone compound, and (D) 2 or more types of mixed solvent, (D) mixed solvent is (gamma) -butyrolactone and propylene A positive photosensitive resin composition comprising glycol monoalkyl ether, wherein the total amount of γ-butyrolactone and propylene glycol monoalkyl ether is 70% by weight or more of the total amount of solvent, a method of producing a patterned resin film using the composition, the composition Provided are a semiconductor device and a display element, and a method of manufacturing the semiconductor device and the display element. |