| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f4f1466d134b86c110a767b08e13f8b1 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-5073
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L71-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-4215
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-686
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29K63-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L71-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C39-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-58
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-68
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-36 |
| filingDate |
2004-06-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_302cd0aa493e23e90aa0f907283a2a92
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_88109d3520970db8bbc0fd99fca7f33c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_315136854a1f052f5001d102f97acf0c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0a7c82d5b87ec1cf9b4ca8347f729a73
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b10004ff5b6b2d4947cbd1903e6120dc |
| publicationDate |
2004-12-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20040108341-A |
| titleOfInvention |
Curable epoxy resin composition, fabrication process using the same and shaped articles obtained therefrom |
| abstract |
Polyepoxides; Anhydrous hardeners; 1-substituted imidazole as a catalyst; One or more diols containing from 5 to 50 phr of the polyepoxide; A curable epoxy resin composition containing a filler and optionally an additive in a content of 200 to 600 phr of the polyepoxide. This shows improved fracture resistance. Also disclosed is an improved method of making a thermoset article. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101252593-B1 |
| priorityDate |
2003-06-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |