| abstract |
The present invention relates to (A) organopolysiloxane represented by the following formula (1), (B) organopolysiloxane represented by the following formula (2, wherein (A) + (B) = 100 parts by weight), (C) thermally conductive filler , (D) an organosilicon compound represented by R 5 c SiX 4-c , wherein R 5 is a monovalent hydrocarbon group, X is a hydrolyzable group, and c is 0, 1 or 2, or a partial hydrolysis thereof A room temperature curable heat conductive silicone rubber composition containing a condensate is provided.n n n n n n n n n n In the formula, R 1 is H or a monovalent hydrocarbon group, R 2 is a monovalent hydrocarbon group, Z is O or a divalent hydrocarbon group, a is 0, 1 or 2, and n is an integer of 10 or more.n n n n n n n n n n In the formula, R 3 is a monovalent hydrocarbon group, R 4 is H or a monovalent hydrocarbon group, b is 0, 1 or 2, and m is an integer of 5 to 200.n n n Moreover, according to this invention, even if a large amount of thermally conductive filler is added, the viscosity rise of a composition is small, it is excellent in portability, coating property, and sealing property, and can provide the room temperature hardening type heat conductive silicone rubber composition which is preferable as a one-part type. |