| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24917
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0355
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1476
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L77-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-384
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09309
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L77-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-25
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0209 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-162
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L77-00 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L77-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K7-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L77-10 |
| filingDate |
2003-04-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2004-11-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20040095147-A |
| titleOfInvention |
Resin containing dielectric filler for formation of built-in capacitor layer of printed wiring board, copper double clad laminate having dielectric layer formed with resin containing dielectric filler, and process for producing copper double clad laminate |
| abstract |
It is an object of the present invention to provide a dielectric layer of a double-sided copper clad laminate used for forming a built-in capacitor layer capable of forming any film thickness without a skeleton material and having a high strength.n n n In order to achieve the above object, "20 to 80 parts by weight of an epoxy resin (including a hardening agent), an aromatic polyamide resin polymer soluble in 20 to 80 parts by weight of a solvent, and a curing accelerator for adding an appropriate amount as necessary formed in a binder resin, the average particle size of 0.1 ~ 1.Oć D IA, a weight cumulative particle diameter D 50 is 0.2 ~ 2.0ć by the laser diffraction scattering type particle size distribution measurement method, a weight cumulative particle diameter D 50 and the image analysis The dielectric filler, which is a dielectric powder having a perovskite structure having an approximately spherical shape having a cohesion value of 4.5 or less, is represented by D 50 / D IA using an average particle diameter D IA obtained by A dielectric filler-containing resin or the like for forming a built-in capacitor layer of a printed wiring board can be used. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20190122644-A |
| priorityDate |
2002-04-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |