| abstract |
On the surface of copper (1), (a) at least one acid selected from inorganic acids and organic acids, (b) tin salt or tin oxide, (c) is zinc, aluminum, titanium, bismuth, chromium, iron, cobalt Contacting a resin adhesive layer-forming liquid comprising an aqueous solution containing a salt or oxide of at least one metal selected from nickel, palladium, gold and platinum, (d) a reaction accelerator, and (e) a diffusion-based holding solvent. And forming an alloy layer of the metal of (c), followed by removing the alloy layer of the tin and the metal of (c), leaving a layer in which the copper and the tin and the metal of (c) are diffusing. And the adhesive layer 2 of resin containing the alloy of copper, tin, and the said (c) metal on the surface of copper. Thereby, the adhesive force of copper and resin can be improved. This invention provides the said adhesive layer forming liquid, the manufacturing method of the adhesive layer of copper and resin using this liquid, and its laminated body. |