| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d54d601404c4a34b6d17773abbfeacca |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24264
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24322
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24331
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31511 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J3-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-04 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 |
| filingDate |
2004-04-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4ad281fc82489316ece40cd50e15ca87
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f73ada32f08ba73d229e011122e8cb1b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e5ac421f63ce45cb1ecf7c157d1e1283 |
| publicationDate |
2004-10-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20040087902-A |
| titleOfInvention |
Granular epoxy resin, production method thereof, and granular epoxy resin package |
| abstract |
The granular epoxy resin is prepared by pulverizing an epoxy resin which is solid at room temperature and may exhibit excellent fluidity during molding due to its low melt viscosity, and has a component of n 1 = 0 in Formula 1 and / or n 2 in Formula 2 The total content of the components having a molecular weight of 500 or less among the components of = 0 is 50% by mass or more of the total epoxy resin, or the components of n 1 = 0 in the formula (1) and / or n 2 = 0 in the formula (2) The total content of components of 400 or less is at least 20 mass% of the total epoxy resin. The content of the low molecular weight compound having a molecular weight of 200 or less in the granular epoxy resin is 0.3 mass% or less. Granular epoxy resins are easy to handle because they hardly cause blocking during storage and transport.n n n n Formula 1n n n n n n n n n n Formula 2 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20190080892-A |
| priorityDate |
2003-04-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |