| abstract |
This invention makes it a subject to solve the nonuniformity of an electrical characteristic, without generating the nonuniformity of a film thickness.n n n In order to solve the said subject, this invention wires the electroconductive film 31 to the wiring pattern area | region PI on the board | substrate P by droplet discharge. On the outer side PO of the wiring pattern region PI on the substrate P, a second conductive film 32 electrically separated from the conductive film 31 is formed by droplet discharge. |