| abstract |
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an alkali developable photosensitive polyimide resin composition suitable for a high heat resistant transparent protective film and an insulating film for a liquid crystal display device. More specifically, in the first step (a-1), an alicyclic tetracarb having 3 to 30 carbon atoms At least one tetracarboxylic dianhydride selected from acid dianhydrides and (a-2) aliphatic, alicyclic or unconjugated aromatic ring systems having 3 to 30 carbon atoms having at least one ethylenically unsaturated bond in the side chain; A transparent linear polyamic acid (A) is prepared by using at least one diamine selected from diamines as an essential component, and in the second step, the polyamic acid (A) is contained in one molecule with an ethylenically unsaturated compound (B) and Reactive transparent polyimide precursor of formula (1) obtained by esterification and alkali developable prepared as a main component Transparent photosensitive polyimide relates to a precursor composition. The photosensitive transparent polyimide precursor resin composition according to the present invention has excellent photosensitivity and has an effect that can be used as a transparent protective film and an insulating film for liquid crystal display devices excellent in heat resistance, chemical resistance, mechanical strength, and electrical insulation.n n n <Formula 1>n n n n n n n n (Wherein R1, R2, X, Y are the same as defined in the specification) |