http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20040081527-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bb83fd72e9c3f3437f1786b86031bc79 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J9-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J175-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-04 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J175-12 |
| filingDate | 2003-03-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fb4bdd46850f7a893a1884b3fbcbe9b4 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dab8cd909f45f2da549fb803cab701bd http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bd293e51ad6b8f7bbe26cfbdbb6bac2d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_70cf1c9bad0385de3a4b1263ae6ee5ab http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_15ed0443f9aadfeb5049e566a7f576a8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_84be38fe726a29610085e7530c177f75 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8a5841b65ce93f564788d9970dec0a6f |
| publicationDate | 2004-09-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20040081527-A |
| titleOfInvention | Composition for circuit adhesion comprising using blocked isocyanate group |
| abstract | In the present invention, a monomer having a carbon double bond; Azo compounds; peroxide; Electroconductive particle; And a compound having at least one blocked isocyanate group. A composition for circuit bonding using a blocked isocyanate group is disclosed. The compound having at least one or more blocked isocyanate groups is preferably contained in an amount of 0.1 to 50% by weight based on 100% by weight of the total amount of the circuit bonding composition, and the conductive particles are 0.1 to about 100% by weight of the total composition of the circuit bonding. It is preferably included in 10% by weight. The circuit bonding composition using the blocked isocyanate group according to the present invention, unlike the conventional circuit bonding composition using a liquid acrylic monomer, has excellent mechanical properties, adhesive strength, fast curing and workability, and has a low curing temperature. |
| priorityDate | 2003-03-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 43.