http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20040078737-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_64605f74fd2854c5874c9fb8d2cca1a7 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-181 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J163-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-04 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 |
| filingDate | 2003-03-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_313e9bb30ba399747201c65ff7b5db30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_eb724249eb50ed32a1bdb35a62804d6a |
| publicationDate | 2004-09-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20040078737-A |
| titleOfInvention | Epoxy-based dotting adhesive for mounting IC packages, manufacturing method thereof, and method for mounting electronic parts |
| abstract | The present invention relates to an epoxy point adhesive for mounting an integrated circuit package for mounting an integrated circuit package on a printed circuit board, a manufacturing method thereof, and an electronic component mounting method.n n n Epoxy dot adhesive for integrated circuit package mounting according to the present invention is 100 parts by weight of epoxy resin, 10 to 60 parts by weight of latent curing agent, 2 to 15 parts by weight of inorganic filler, 6 to 30 parts by weight of thixotropic agent, and 0.1 to 3 pigments. It includes parts by weight.n n n The epoxy point adhesive for mounting an integrated circuit package of the present invention, a method for manufacturing the same, and a method for mounting an electronic component have little or no thermal shock to an integrated circuit package because there is no installation and maintenance cost of a curing furnace and a temporary soldering process is unnecessary. Do not generate the smell of soldering. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100836064-B1 |
| priorityDate | 2003-03-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 29.