http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20040067843-A
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-1047 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02337 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02282 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02203 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76837 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02129 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-7682 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-31 |
| filingDate | 2002-01-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2004-07-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20040067843-A |
| titleOfInvention | Dielectric films for narrow gap-fill applications |
| abstract | Colloidal suspensions of nanoparticles consisting of concentrated materials dispersed in a solvent are used to form gap filled dielectric materials with low heat shrinkage. Dielectric materials are particularly useful for pre-metal dielectrics and shallow trench isolation. In a method of forming a dielectric material, a colloidal suspension is deposited on a substrate and dried to form a porous interlayer. The intermediate layer is deformed by penetrating and curing liquid matrix materials such as spin-on polymers, or by penetrating and curing gaseous matrix materials only, to provide gap fill, thermal stability, and etch resistant dielectric materials. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20200036178-A |
| priorityDate | 2002-01-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 64.