| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_36f8253f3d0d59bcd9259217d4385d10 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73253
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-055
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F24C3-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F24C3-082
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-0483 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-055 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-073
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-66
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R33-76
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-04 |
| filingDate |
2004-01-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5664764e2355cbfb92d3e7dc4d628b48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a5ac27dfbd0e6ed009724d5bcba6f059
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2862972f7075f0aafd12a98f70296f97 |
| publicationDate |
2004-07-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20040064643-A |
| titleOfInvention |
Carrier for receiving and electrically contacting individually separated dies |
| abstract |
Carrier with a first contact for receiving and electrically contacting separate dies (bare chips) for testing and burn-in of the die, arranged in contact with the die in a grid pattern The present invention relates to a carrier in which individually separated dies can be precisely mechanically and electrically contacted, thereby performing functional tests and burn-in with existing equipment, in particular the "existing good die concept". It is based on the purpose of realization. This object is achieved by a first contact of a carrier with an elastomeric bump, the elastomeric bump being on a second contact of the tip in electrical contact with the first contact, and the predetermined force generated by the vacuum being the elastic bump Made by the die being delivered to. |
| priorityDate |
2003-01-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |