http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20040059452-A

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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-7684
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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-283
filingDate 2002-12-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cf30c40a58d3e69d910b0eb465bfe4df
publicationDate 2004-07-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20040059452-A
titleOfInvention Method for protecting demage of electric conductor in semiconductor process
abstract The present invention discloses a method for preventing damage to a conductor in a semiconductor process by masking an upper surface of a conductor in which voids are opened due to chemical mechanical polishing, thereby preventing damage to the lower conductor during contact or plug formation.n n n The method for preventing conductor damage in the semiconductor process of the present invention forms a lower conductor having a hard mask made of plasma deposited nitride thereon, and forms a plug poly in a specific region by chemical mechanical polishing, wherein the hard mask and the By forming an auxiliary mask between the lower conductors, when a void that can be formed in the hard mask is opened by the chemical mechanical polishing, a contact between the conductor and the chemical that penetrates through the open voids in a subsequent cleaning process is prevented. You can prevent it.
priorityDate 2002-12-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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