http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20040048561-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e7af4e8fa1b429312eb8301680824595 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1463 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-30625 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14 |
| filingDate | 2002-12-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e28b80f8fb013c2534e025e9b5fc3650 |
| publicationDate | 2004-06-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20040048561-A |
| titleOfInvention | Chemical mechanical polishing fluid composition |
| abstract | The present invention relates to a chemical mechanical polishing composition, and more particularly, to a colloidal silica sol in which silica content and particle size are controlled, a dispersant, an accelerator of abrasion of organic amines, and silicic acid are added at a predetermined ratio. By suppressing the content of particles, it has less scratches after polishing than conventional abrasive compositions, and is excellent in removing impurities adsorbed on the surface of the wafer after cleaning. Therefore, the chemical mechanical polishing composition can effectively polish the surface of the semiconductor silicon wafer. It is about. |
| priorityDate | 2002-12-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 37.