| abstract |
The present invention relates to a die attach adhesive, a method of use thereof, and an apparatus obtained using the method. For example, in the use of semiconductor chips, the present adhesives and methods using the same provide a boundary between the chip (die) and the chip support. This method creates a space between the chip and the chip support with open holes of a given size. The die attach adhesives of the present invention are curable polymer based materials and inorganic insulating particles contained in the polymer based materials having an average particle size of 1 to 1,000 μm and an aspect ratio of major axis to minor axis of about 1.0 to 1.5, and curable Linear before and after any glass transition temperature of less than 240 μm / m / ° C. at −55 to + 200 ° C., measured at a heating rate of 5 ° C./min, in an amount greater than 50 wt% based on the amount of polymeric base material At least one low thermal expansion coefficient filler present in an amount sufficient to obtain an adhesive having a thermal expansion coefficient as a mixture, wherein the thermal expansion coefficient filler having a size in the range of 10 to 100 μm is 0.1 weight Curable adhesive composition present in less than%. |