http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20040035073-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_cf213be03285a0b93967ae2fd2fd351a |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1463 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14 |
| filingDate | 2002-10-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a57316099f7efaed57a29dddf18e21c3 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6712c00733c89d291bed89132b0fcdc7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_804d6ac18ba1f4251b6807f0ec4583e2 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_69a9adec1d68d8ef18c94d07467104ee |
| publicationDate | 2004-04-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20040035073-A |
| titleOfInvention | Chemical Mechanical Polishing Slurry Composition For Polishing Tungsten Metal Layer Having Improved Dispersion Stability |
| abstract | A chemical-mechanical polishing slurry composition is disclosed that is excellent in dispersion stability for tungsten metal films. The slurry composition is selected from the group consisting of (i) propylenediamine tetraacetic acid-containing metal compounds, (ii) ethylenediamine tetraacetic acid-containing metal compounds, (iii) ethylenediamine tetraacetic acid-containing compounds, (iv) Fe-containing compounds and mixtures thereof. Selected dispersion stabilizers, abrasives, oxidants, tungsten polishing enhancers and water, pH 2-9. Here, the content of the abrasive is 0.1 to 20.0% by weight based on the total slurry composition, the content of the oxidant is 0.1 to 10.0% by weight, the content of the tungsten polishing enhancer is 0.001 to 5.0% by weight, the content of the dispersion stabilizer is 0.001 to It is preferably 1.0% by weight, and may further comprise 0.001 to 5.0% by weight of the silicon oxide film polishing inhibitor based on the total slurry composition. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100497409-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100850877-B1 |
| priorityDate | 2002-10-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 143.