| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_73ebc284a55d5daf0e209d6186c9e65c |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-284
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09381
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10977
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48227
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48465
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09227
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02P70-50 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3436
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-111 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-18 |
| filingDate |
2003-10-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a618d1cae0ad7f65a6342ec270b536b8 |
| publicationDate |
2004-04-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20040033268-A |
| titleOfInvention |
Circuit board, mounting structure of a semiconductor device having a bump attached thereto, and electro-optical device and electronic apparatus |
| abstract |
In the case of solder reflow mounting of a bumped semiconductor element such as BGA with respect to a substrate such as an FPC, a circuit board and a bumped semiconductor are less likely to have a poor application of solder material, and the mounting position of the bumped semiconductor element is shifted. A method for mounting an element, and an electro-optical device using such a circuit board, and an electronic device are provided.n n n A circuit board comprising a plurality of pads for mounting a semiconductor element with bumps, a plurality of wirings drawn out from the plurality of pads, a mounting structure of a semiconductor element with bumps, an electro-optical device, and an electronic device, wherein the circuit board The wirings from the pads are preferentially drawn out from the side in which the pitches in the longitudinal direction and the transverse direction of the plurality of pads are different from each other and the pitch in either the vertical direction or the horizontal direction is wide. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100791265-B1 |
| priorityDate |
2002-10-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |