| Predicate |
Object |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-092
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-11 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-09 |
| filingDate |
2002-03-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2004-04-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20040030543-A |
| titleOfInvention |
Photosensitive film for circuit formation and process for producing printed wiring board |
| abstract |
The photosensitive film for circuit formation of this invention has a photosensitive layer of 0.1-10 micrometers thick on the 1st film (base film), or has a photosensitive layer of 0.1-14 micrometers thick, 2-bis (4-((meth) acryloxypolyalkoxy) phenyl) propane. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2008150081-A1 |
| priorityDate |
2001-03-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |