| abstract |
Ammonia-free hydrofluoric acid-free cleaning composition useful for cleaning photoresist and plasma ash residues of microelectronic substrates, particularly for microelectronic substrates characterized by hypersensitive low dielectric constant and high dielectric constant dielectrics and copper wiring. The cleaning composition comprises one or more fluorides (ammonia free, tetravalent ammonium fluorides) which do not generate ammonia and do not generate hydrofluoric acid in a suitable solvent matrix. |