http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20030086251-A
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-7684 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-32115 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-32134 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53238 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-302 |
| filingDate | 2002-01-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2003-11-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20030086251-A |
| titleOfInvention | Planarizers for spin etch planarization of electronic components and methods of use thereof |
| abstract | The illustrated electronic component may include a substrate layer 110, a dielectric layer 120 coupled to the substrate layer 110, a barrier layer 130 coupled to the dielectric layer 120, and a conductive layer coupled with the barrier layer 130. 140 and a protective layer 150 coupled to the conductive layer 140. A method of manufacturing an electronic component includes providing a substrate 110 that couples a dielectric layer 120, coupling the barrier layer 130 to a dielectric layer 120, and conducting layer 140 to the barrier layer 130. Coupling the protective layer 150 to the conductive layer 140. A method of planarizing a conductive surface of an electronic component may include inserting or bonding a protective layer 150 to a conductive layer 140, dispersing the protective layer 150 relative to the conductive layer 140, and the protective layer 150. Hardening, inserting an etching solution into the conductive layer 140, and etching the conductive surface in a substantially planar manner. |
| priorityDate | 2001-01-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 48.