| abstract |
The present invention relates to a water-soluble plating liquid composition for a gold-silver alloy applied to the surface treatment for mounting parts of a modular printed circuit board (modular PCB), at least one sulfonic acid group (- 1-30% by weight of organic acid having SO 3 H), 0.1-20% by weight of complexing agent, 0.1-15% by weight of thio compound having at least one -S-, 0.05-5% by weight of water-soluble gold compound, 0.001 of water-soluble silver compound To 1% by weight and 0.1 to 10% by weight of the metal ion blocking agent. When the plating solution is used, the dual plating process of the soft electroless gold plating and the hard electrolytic gold plating performed in the conventional modular PCB manufacturing while satisfying all the plating characteristics required for each of the pad portion and the terminal portion of the modular PCB is performed. It can be replaced by a plating process, which has the advantage of contributing to the simplification of the process, productivity improvement and cost reduction. In particular, the plating solution of the present invention is applicable to all modular PCBs used in semiconductor mounting. |