| abstract |
The flip-chip type semiconductor device includes a semiconductor chip 22 having electrode pads 24 formed and arranged on a chip surface. Sprout-type metal bumps 26 are bonded to the chip-shaped electrode pads, and adhesive resin layers 32 and 32 'are formed on the chip surface of the chip so that the tips of the spout-type metal bumps protrude from the adhesive resin layer. . The periphery of each of the sprouted metal bumps is surrounded by a protective resin material (38, 38 ') that is wholly swollen from the adhesive resin layer such that the tip surface of each of the sprouted metal bumps is at least exposed to the outside. All. |