http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20030075681-A

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b3310ea86f3c492f6c09d7be6592866d
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-78
filingDate 2002-03-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b1cafcec16cd67c658438a6815dd1be0
publicationDate 2003-09-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20030075681-A
titleOfInvention A wafer dicing method for preventing a chipping
abstract BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer dicing method belonging to a package process in a semiconductor manufacturing process. In particular, in a dual type spindle method used in the dicing method, the first spindle is cut down, The two spindles are designed to solve both chipping at the upper end of the wafer cutting surface and chipping at the lower end of the wafer cutting surface by applying an upward cutting method.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20180104566-A
priorityDate 2002-03-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-950004492-A
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419591030
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID11508377

Total number of triples: 15.