http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20030075681-A
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b3310ea86f3c492f6c09d7be6592866d |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-78 |
filingDate | 2002-03-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b1cafcec16cd67c658438a6815dd1be0 |
publicationDate | 2003-09-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | KR-20030075681-A |
titleOfInvention | A wafer dicing method for preventing a chipping |
abstract | BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer dicing method belonging to a package process in a semiconductor manufacturing process. In particular, in a dual type spindle method used in the dicing method, the first spindle is cut down, The two spindles are designed to solve both chipping at the upper end of the wafer cutting surface and chipping at the lower end of the wafer cutting surface by applying an upward cutting method. |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20180104566-A |
priorityDate | 2002-03-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 15.