http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20030074416-A
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G2-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G9-012 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G4-236 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G9-012 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G9-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G13-00 |
| filingDate | 2003-03-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2003-09-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20030074416-A |
| titleOfInvention | A chip type capacitor, a method for preparing the same and an anode terminal used for preparing the same |
| abstract | (assignment)n n n Provided are a chip capacitor with improved bonding strength and reliability of a cathode lead wire and a cathode terminal plate, a method of manufacturing the same, and a cathode terminal plate used in the manufacture of the chip capacitor.n n n (Solution)n n n A part of the projection of the anode lead wire which is mounted in the concave groove formed in the projection of the anode terminal plate having a pair of flat plate-like projections is a cross section substantially perpendicular to the direction in which the anode lead projects from the element body. About 75% or more of the outer circumference is covered by the solidified material of the melt formed by heating and melting the protrusion of the positive electrode terminal plate having a portion that is higher than the mounting position of the positive electrode lead wire, and the positive lead wire and the positive electrode The terminal plate is joined. |
| priorityDate | 2002-03-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 17.