http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20030070919-A
Outgoing Links
Predicate | Object |
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classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-123 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-001 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D17-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D17-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12 |
filingDate | 2002-02-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate | 2003-09-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | KR-20030070919-A |
titleOfInvention | Plating device and plating method |
abstract | Provided are a plating treatment apparatus and a plating treatment method capable of uniformly forming a plating by a treatment surface of a workpiece. A plating solution tank including a first electrode capable of accommodating a plating solution and being immersed in the contained plating solution, a workpiece holding mechanism for holding a target object and bringing the target surface into contact with the plating liquid, and a workpiece holding mechanism, In order to make the conductive layer of the to-be-processed surface which contacted the plating liquid as a 2nd electrode, it has the contact which electrically contacts the peripheral part of a to-be-processed object, and a contact has a bellows structure or a spring structure which moves in the direction opposing a to-be-processed object, The target object holding mechanism can hold the target object in a state where the bellows structure of the contact or the like is compressed. By making the contact itself from the rigid structure to the flexible structure, the contact resistance is fixed by the controlled contact pressure fluctuation so that the fluctuation in the contact pressure becomes small even if a slight displacement in the compression direction occurs. |
priorityDate | 2001-02-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Predicate | Subject |
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isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419512635 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID962 |
Total number of triples: 19.