patent/KR-20030070075-A

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20030070075-A

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filingDate	2001-12-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate	2003-08-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	KR-20030070075-A
titleOfInvention	Solder foil and semiconductor device and electronic device
abstract	The solder foil formed by rolling a solder material containing particles such as Cu as metal particles and Sn particles as solder particles is suitable for performing high temperature side solder connection in a temperature monolayer connection, and using such a solder connection The semiconductor device and the electronic device which can be obtained are excellent in mechanical characteristics, etc., and excellent in reliability.
isCitedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9610655-B2
priorityDate	2000-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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Total number of triples: 112.