Predicate |
Object |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31678 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0769 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0215 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24917 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-2991 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0373 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09118 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12014 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S428-901 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-185 |
classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 |
filingDate |
2002-12-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate |
2003-07-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
KR-20030057314-A |
titleOfInvention |
Circuit board and method of producing the same |
abstract |
The present invention provides a circuit board having a resin molded body containing a metal powder having an insulating film on its surface, and a metal wiring comprising a metal deposited by electroless plating on a wiring pattern drawn by a laser beam on the surface of the resin molded product, and a manufacture thereof. It is a way.n n n According to the present invention, a short circuit hardly occurs and a circuit board having high adhesion to a resin substrate is provided. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20180058261-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101134873-B1 |
priorityDate |
2001-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |