http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20030057085-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_aafe0172ffd94d3486c518b0709bb2b3 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-02 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K9-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-295 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate | 2001-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d04d93db74aab99b193f65e7b7c7cf6e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8fbb4f150b5fb0286d407076603bc868 |
| publicationDate | 2003-07-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20030057085-A |
| titleOfInvention | Epoxy resin composition for sealing semiconductor device |
| abstract | The present invention relates to an epoxy resin composition for sealing semiconductor devices, and more particularly, to an epoxy resin composition for sealing semiconductor devices including an epoxy resin, a curing agent, a curing accelerator, an inorganic filler, and other additives, wherein the epoxy resin is an allocresol furnace. It is used by mixing a rockac epoxy resin and a diglycidyl hexamethyl biphenyl type epoxy resin, and using a cyanate ester resin prepolymer and a naphthalene type phenol resin as a hardening | curing agent, and adding the pretreatment coupling agent to this. The present invention relates to an epoxy resin composition for sealing a semiconductor device, wherein the present invention improves the peeling problem generated between the wafer chip surface and the epoxy encapsulant and is a high temperature solder process applied during lead-free in a later step. It improves the crack problem on the pad surface and the chip later, It is possible to provide an epoxy resin composition for semiconductor element sealing that satisfies high adhesiveness and formability by improving void formability defects occurring at the upper end. |
| priorityDate | 2001-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 60.