http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20030046050-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_2707056d594790a62947ee030653e6f8 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L79-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D11-03 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D11-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D11-03 |
| filingDate | 2001-12-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fb1598f957b2c44ebe013e7fd0189494 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2d368ebbf5a449ba8293e409309cb74c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ca23c88d3b554909e671f8ca9f40c46c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ad8ebc71ed860a0d95c93f81eb20f463 |
| publicationDate | 2003-06-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20030046050-A |
| titleOfInvention | Composition for solder resist ink having superior tolerance to gold plating |
| abstract | The present invention relates to an ink composition for solder resist excellent in gold plating resistance, and more particularly to an ink composition for solder resist excellent in electroless gold plating resistance including polyamic acid as an electroless gold plating resistance improving agent in an ink composition for solder resist. will be.n n n According to the present invention, the electrical circuit of the printed circuit board can be protected from external contamination and contact, and at the same time, the solder resist coating can be prevented from being peeled or damaged after electroless gold plating of the printed circuit board, as well as dryness. The solder resist coating film excellent in adhesiveness, electrical insulation, soldering heat resistance, solvent resistance, alkali resistance, acid resistance, and electroless gold plating resistance can be formed. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7346982-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20160120420-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20160130125-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103145988-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20040042999-A |
| priorityDate | 2001-12-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 128.