| abstract |
This invention relates to the photosensitive resin composition excellent in heat resistance, workability, and adhesiveness, the soldering resist using the same, the coverlay film using these, and a printed wiring board. The coverlay film of this invention has sufficient mechanical strength, is excellent in workability and adhesiveness at comparatively low temperature, has a low elastic modulus after hardening, and is suitably used also as a coverlay film for a printed circuit board or a hard disk. It is soluble, can be laminated at a temperature of 150 ° C or less, has excellent characteristics such as solder resist, heat resistance, etc., which can be laminated directly to FPC without going through an adhesive, and is less likely to cause warping when laminated to FPC. To provide. (A) Soluble polyimide which melt | dissolves in the boiling point solvent of 120 degrees C or less, (B) The compound which has one or more aromatic rings and two or more double bonds in 1 molecule as an essential component, The soluble polyimide at least Since the lamination temperature is relatively low using the photosensitive resin composition obtained using the acid dianhydride which has 1-6 aromatic rings, the alicyclic acid dianhydride, and / or the diamine which has 1-6 aromatic rings, A soldering resist, a coverlay film, etc. which are excellent in heat resistance and a mechanical characteristic, without damaging a board | substrate are provided. |