| abstract |
The present invention relates to a sealing epoxy resin molding material for a semiconductor device having a semiconductor chip disposed on a thin, multi-pin, long wire, fine pad pitch or a mounting substrate having excellent fluidity, and poor molding such as a wire sweep and a bubble sealed thereby. The present invention relates to a semiconductor device in which semiconductor chips are disposed on a thin, multi-pin, long wire, narrow pad pitch, or mounting substrate with less occurrence of then n n That is, this invention is an epoxy resin molding material for sealing which makes (A) an epoxy resin, (B) hardening | curing agent, and (C) a secondary amino group the silane coupling agent, or (D) phosphate ester an essential component, and was sealed by this A semiconductor device. |