abstract |
An object of the present invention relates to an electronic device such as a semiconductor device having an external terminal, a wiring board, and the like, and to prevent deterioration of the bonded terminals or the bonded wiring and terminals.n n n In order to solve the said subject, the sealing insulating film 9 formed on the board | substrate 1, and melt | dissolved by 1st heating temperature, and having fluidity | liquidity, and the 2nd formed on the said board | substrate 1 and higher than 1st heating temperature are mentioned. It is connected to the other electronic device 11 by heating temperature, and includes the external terminal 7 surrounding the circumference | surroundings with the said sealing insulating film 9. |