| abstract |
In an integrated circuit having a plurality of IC modules, each IC module has attachment planes to which components of the IC are attached, and has an interlocking edge adjacent to the attachment plane. Interlocking edges of the adjacent IC modules are combined to form a structural connection between the IC modules. The interlocking edges have a plurality of teeth and recesses, the teeth and recesses arranged to form a row. The teeth are safely received by respective recesses at adjacent interlocking edges to form a structural connection between adjacent IC modules. Additionally, the interlocking edges may be ridge members or ridge recesses, wherein the ridge members or ridge recesses are each ridge recess or ridge member of adjacent IC modules to form a structural connection between the IC modules. Are safely accepted by the The interconnect edge may also be the ridge member, the ridge recess and / or the combination of rows of teeth and recesses.n n n The attachment planes of adjacent IC modules may or may not be coplanar, and the position is determined by the required shape. The components of the modules exchange information using either external connection passages and / or internal connection passages using conventional wire-bond techniques or using conductive layers inside the IC modules. The IC module may be formed of conventional Si wafers. Using this structure, an IC is constructed that uses a smaller placement space and is suitable when the housing is not present in a plane, the configured IC resulting in an improvement in speed due to the reduced length of the connection passage. |