| abstract |
The present invention is to provide a semiconductor device in which the accuracy of the position at which the semiconductor chip is mounted on the package is improved without being affected by the performance of the mounting apparatus such as a die bonder. When placed on the die pad portion 3a, the semiconductor device is supplied by the guide protrusion 4 and the spring protrusion 5 provided around the die pad portion 3a, and the semiconductor chip 1 is Die bonded while being aligned relative to the guided protrusion 4. |