| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_33c922e05f6133b7d72dbb849d77487d |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D9-005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02071
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-039
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D11-0047
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-425
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-422 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-42 |
| filingDate |
2001-10-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_825b2db29839cdf4e80afe4478f951a3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b76b5ee255e2705762301b92a8e8a1ef
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6c952e24c6d671096b816d8443a9af2a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_590246d67c1479805d03ab49982270a0 |
| publicationDate |
2003-04-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20030032358-A |
| titleOfInvention |
Photoresist stripper composition |
| abstract |
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to stripper compositions for photoresists used in the manufacture of semiconductor devices and liquid crystal display devices, particularly a) 5 to 50% by weight of a water-soluble organic amine compound; b) 20 to 70% by weight of a protic alkylene glycol monoalkyl ether compound having a boiling point of at least 150 ° C; c) 0.01 to 2 weight percent of a corrosion inhibitor; And d) 0.01 to 70% by weight of a polar aprotic solvent.n n n According to the present invention, the photoresist film modified during the photolithography process can be easily removed within a short time even at a high temperature and a low temperature, and a stripper composition for a photoresist having less corrosion on the conductive film and the insulating film under the photoresist can be provided. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100964801-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020532880-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20030076093-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20140132185-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-107239006-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-107239006-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20050087357-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20150115457-A |
| priorityDate |
2001-10-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |