| abstract |
The present invention is an electronic component in which a semiconductor chip is mounted on a wiring circuit board in a state in which a connecting electrode part provided on a semiconductor chip and a connecting electrode part provided on a wiring circuit board are opposed to each other. The voids consist of a liquid epoxy resin composition comprising (A) a liquid epoxy resin, (B) a curing agent, (C) an inorganic filler and (D) a N, N, N ', N'-4 substituted fluorine-containing aromatic diamine derivative. The present invention relates to an electronic component filled with a sealing resin layer. |