| abstract |
The present invention is a carrier in which a release layer, a diffusion barrier layer and an electroplating layer are laminated on the carrier foil surface in this order, or a diffusion barrier, release layer and an electroplating layer are laminated in this order, and the electroplating surface is roughened. Provided ultra-thin copper foil, the ultra-thin copper foil with a carrier is provided with the copper clad laminated board laminated | stacked on the resin base material, the printed wiring board in which the wiring pattern was formed on the ultra-thin copper foil of the said copper clad laminated board, and the multilayer printed wiring board in which multiple printed wiring boards were laminated | stacked. |