| abstract |
The present invention relates to metal plating baths and metal plating methods containing aldehyde compounds which prevent or reduce the consumption of metal plating bath additives. The metal plating bath of the present invention provides an efficient plating method because there is no need to interrupt the plating process to replenish the additive in the plating bath. The metal plating bath of the present invention can be used to plate metals such as copper, gold, silver, palladium, platinum, cobalt, chromium, cadmium, bismuth, indium, rhodium, iridium and ruthenium. |