| abstract |
The present invention relates to a photosensitive resin composition for photoresist, more specifically (A) i) a compound represented by the following formula (1); Ii) unsaturated carboxylic acids, unsaturated carboxylic anhydrides, or mixtures thereof; Iii) epoxy group-containing unsaturated compounds; And iii) an acrylic copolymer obtained by copolymerizing an olefinically unsaturated compound; And (B) a 1,2-quinonediazide compound.n n n [Formula 1]n n n n n n n n (In Formula 1, R 1 and R 2 may be the same or different, respectively, and each independently an alkoxy group represents a hydrogen atom, C 1 ~C 5, or C 1 ~C 5) n n n The photosensitive resin composition according to the present invention has excellent sensitivity, resolution, as well as insulation, flatness, and chemical resistance, and is particularly easy to form an interlayer insulating film pattern and excellent in transmittance even in a thick film to be used as a photoresist in an LCD manufacturing process. effective. |