| abstract |
An object of the present invention is to provide a multilayer printed wiring board having excellent reliability because the wiring distance of the conductor circuits is short, the freedom of designing the conductor circuit is high, and in addition, almost no crack occurs in the interlayer resin insulating layer near the via hole. The present invention relates to a multilayer printed wiring board in which a conductor circuit and an interlayer resin insulating layer formed in series on a substrate are alternately repeatedly provided, wherein the connection of the conductor circuits through the interlayer resin insulating layer is performed by a via hole, and a layer among the via holes. The via diameters are formed so that different via holes form a stack via structure, and the land diameter of at least one of the land diameters of the above-mentioned via holes in which the layers having the stacked via structure are different is different from the land diameters of the other via holes. |