| abstract |
Disclosure of Invention An object of the present invention is to reduce thermal stress or thermal distortion occurring during manufacturing or operation, and to avoid deformation, modification and destruction of each member, and to provide high signal properties and a low cost semiconductor device. A composite member, an insulating semiconductor device using the same, or a non-insulating semiconductor device is provided. The composite member for semiconductor devices of this invention contains the composite metal plate which disperse | distributed the particle | grains of a cuprous oxide in a copper matrix, Comprising: The surface of the said composite metal plate is coat | covered with a metal layer, and the interface made of the said composite metal layer and the said metal plate is carried out. A copper layer having a thickness of 0.5 μm or more is interposed. |