http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20020093901-A

Outgoing Links

Predicate Object
classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-1608
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0445
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3205
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-52
filingDate 2001-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2002-12-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20020093901-A
titleOfInvention Method of forming vias in silicon carbide and resulting devices and circuits
abstract Disclosed are a method of fabricating an integrated circuit on a silicon carbide substrate that does not have wiring bonds that can cause undesirable inductance. The method includes fabricating a semiconductor device on a first side of a silicon carbide substrate having at least one metal contact for the device. The opposing second side of the substrate is polished and polished until it is substantially transparent. The polished second side of the silicon carbide substrate is then masked to define a predetermined location for the via opposite the metal contact on the first side. The etch is etched through the masked position to form vias until the etch reaches the metal contacts on the first face. The via is metallized to form an electrical contact from the second side of the substrate to the device and the metal contacts on the first side of the substrate.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101156837-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100763670-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7888713-B2
priorityDate 2000-04-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559477
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID6356
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID17358
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID482532689
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID14917
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID14792
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID6547
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID25135
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID28179
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559561
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID29011
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5462311
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559562
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419491805
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID458431511
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23985
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23963
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID9863
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419527022
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419549006
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419523934
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID447604988
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559585
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419546674
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23939
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID57350325
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID415712843
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID414859283

Total number of triples: 48.