| abstract |
The packaged power device includes a substrate having a first conductive layer, a second dielectric layer, and a third conductive layer. The first conductive layer is coupled to the second dielectric layer and the second dielectric layer is coupled to the third conductive layer. The first and third conductive layers are electrically insulated from each other. The substrate has a bottom surface. The semiconductor die is bonded to the first conductive layer of the substrate. The plastic package contains a die and has a bottom surface. The curved backside includes the plastic package and the bottom side of the substrate. |