http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20020081042-A
Outgoing Links
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|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8b84c9fa3ae2f2e80144712433c6130e http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8407f8a0dc01191a63f3d6a1358347ed |
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| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0055 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32009 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32541 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05H1-00 |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05H1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01J37-32 |
| filingDate | 2001-12-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8e05bc7b7d4334040c4d3ca3eb512d62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c7ce8dd05554e7d330f50377245f2dfe http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7f59960f7e1fc1381a3007ee1ca1473f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_59a86dc5039c46c47cd9a8eff14ba2ff http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_79ba11172e57155fe40717b84a3b1d7e |
| publicationDate | 2002-10-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20020081042-A |
| titleOfInvention | Method and apparatus for fabricating printed circuit board using atmospheric pressure capillary discharge plasma shower |
| abstract | The present invention discloses a method and apparatus for treating materials of a manufacturing process using capillary discharge plasma. More specifically, at least one first electrode receiving power and having at least one first and second side surfaces, the first side being coupled to the first electrode and the second side extending in the direction of the first side. Removes debris from holes in the laminated substrate using an atmospheric capillary discharge plasma apparatus having a dielectric body having a capillary of and having a dielectric body in which each capillary is substantially aligned in line with each electrode, and a second electrode electrically coupled to the first electrode. And a method of forming a conductive material in the hole, the method comprising drilling a copper laminated substrate to remove at least a portion of the copper laminated substrate, placing the copper laminated substrate having holes in the apparatus, the potential at the plasma generator Applying a gas, supplying a working gas in close proximity to the laminated substrate, and capillary discharge plasma from the capillary Generated by and a step of forming a conductive material on a copper laminated board, comprising the step, and a hole inside for handling copper laminate substrate with an atmospheric pressure plasma discharge capillary so as to remove the resin residue in the hole. |
| priorityDate | 2001-04-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 35.